Pattern inspection tool - method and apparatus
US4365163A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Dec 19, 1980 |
| Grant date | Dec 21, 1982 |
| Priority date | — |
| Expiry date | Dec 19, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01J37/3045
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
This describes an automatic defect inspection system as could be applied to metallized masks or other patterns. The system causes each subfield to be individually aligned for inspection irrespective of the previous alignment of the pattern or any other sub-field. This is accomplished by scanning a preselected portion of each sub-field and adjusting the position of the scan based on the resulting signal while scanning a pre-established portion of the sub-field. In this way a portion of each sub-field is used as an alignment mark and stepping errors avoided. Once alignment is achieved a probe, comparable to the size of the minimum defect to be detected is scanned over the sub-field with an overlapping pattern to find defects such as excessive metal, metal in improper places or points where the metal is missing.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.