Resin composition
US4367314A · kind A · utility
6Cited by
4References
16Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 5, 1981 |
| Grant date | Jan 4, 1983 |
| Priority date | — |
| Expiry date | Jan 5, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L67/06
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A setting resin composition, comprising: PA0 (A) an unsaturated polyester having at least 30% of all the terminal groups thereof sealed each with a group represented by the general formula (I): ##STR1## wherein, n stands for an integer of 0 to 8, and (B) a dicyclopentadiene type resin containing 50 to 100% by weight of polymerized dicyclopentadiene units.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.