Epoxy resin composition
US4367318A · kind A · utility
13Cited by
10References
22Claims
0Family size
Assignees
Inventors
Key dates
| Filing date | Feb 26, 1980 |
| Grant date | Jan 4, 1983 |
| Priority date | — |
| Expiry date | Feb 26, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/934
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An epoxy resin composition comprising PA0 (1) about 20 to about 80% by weight of a solid epoxy resin, and PA0 (2) about 80 to about 20% by weight of a solid resole-type phenolic resin having a softening point of about 70.degree. to about 90.degree. C., a gel time at 150.degree. C. of at least about 80 seconds and a methylol index of about 25 to about 45, said phenolic resin being a condensation product of 1 mol of a phenol with 1 to about 4 mols of an aldehyde.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.