Method of using copolyether ester amides as thermoplastic adhesives for heat sealing textiles
US4368090A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Nov 17, 1980 |
| Grant date | Jan 11, 1983 |
| Priority date | — |
| Expiry date | Nov 17, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T442/2746
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Copolyether ester amides having a melting point between about 85.degree. and 140.degree. C. are produced from: PA1 (A) lactams or omega-aminocarboxylic acids and/or equivalent amounts of dicarboxylic acids and diamines as polyamide-forming compounds; and PA1 (B) dicarboxylic acids and polyalkylene oxide diols as polyether ester forming compounds as thermoplastic adhesives for heat sealing textiles, where PA1 the polyamide forming compounds consist of at least 30% by weight of lauryllactam and the remaining compounds together with lauryllactam result in copolyamides which have melting points which lie in the range between about 90.degree. to 150.degree. C.; PA1 aliphatic dicarboxylic acids are used as the dicarboxylic acids; and PA1 components A and B are used in the weight ratio from 93/7 to 35/65.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.