Process for preparing nickel layer
US4368223A · kind A · utility
254Cited by
6References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 1, 1981 |
| Grant date | Jan 11, 1983 |
| Priority date | — |
| Expiry date | Jun 1, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC23C18/34
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A nickel layer is prepared by applying a nickel salt and a reducing agent for reducing said nickel salt, on a substrate and reducing said nickel salt by a chemical reaction. The chemical reduction is carried out in the presence of at least one compound selected from the group consisting of diethylenetriamine, and imidazole.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.