Process for producing smoother ceramic surfaces
US4369154A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 3, 1980 |
| Grant date | Jan 18, 1983 |
| Priority date | — |
| Expiry date | Nov 3, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K3/0011
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
In a process for producing a ceramic substrate for use in an electrical packaging structure, according to which (1) a substantially homogeneous ceramic mass, comprising alumina or glass ceramic, an organic bonding agent, a plasticizing agent, an emulsifying agent, a glass frit, and a solvent, is formed into a cohesive flat strip, (2) said strip is green dried and cut into desired size substrates, and (3) said substrates are sintered, the improvement comprising the step of lapping the substrates prior to the sintering step, whereby, after sintering, a smoother surface is obtained on said substrates than is obtained with substrates that have not been so lapped.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.