Diamond compact for a wire drawing die and a process for the production of the same
US4370149A · kind A · utility
26Cited by
4References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 23, 1981 |
| Grant date | Jan 25, 1983 |
| Priority date | — |
| Expiry date | Jan 23, 2001 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB01J2203/0685
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
This invention relates to a diamond compact for a wire drawing die, which comprises 70 to 95% by volume of diamond powder with a particle size of at most 50 microns and the balance of a binder phase consisting of a carbide of WC or (Mo, W)C with a particle size of at most 1 micron and an iron group metal, the carbide and iron group metal in the binder phase being in such a proportion by weight that the content of the carbide is more than that corresponding to the eutectic composition.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.