Thermosetting composition combined high vinyl diolefin polymer with high vinyl low vinyl diolefin polymer
US4370448A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Mar 24, 1981 |
| Grant date | Jan 25, 1983 |
| Priority date | — |
| Expiry date | Mar 24, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/914
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermosetting composition in which high vinyl diolefin polymer chosen from among homopolymers of 1,3-butadiene and copolymers of 1,3-butadiene with styrene are admixed with about 15 to about 35 weight percent of the total polymer phase of a normally solid, elastomeric 1,3-butadiene homopolymer having high vinyl and low vinyl segments in a weight ratio of about 60:40 to about 40:60. Preferably the thermosetting composition also contains from about 15 to about 35 weight percent of the total polymeric phase of a normally solid rubbery polymer of isobutylene. A method for improving the impact strength of cured polymeric compositions in which high vinyl diolefin polymers selected from homopolymers of 1,3-butadiene and copolymers of 1,3-butadiene and styrene are admixed with about 15 to about 35 weight percent of the total polymer phase of a normally solid, elastomeric 1,3-butadiene homopolymer having high vinyl and low vinyl segments in a weight ratio of about 60:40 to about 40:60, and a curing agent, and then subjecting the composition to curing conditions. Preferably the method the composition also has admixed therein from about 15 to about 35 weight percent of the total polymeric p…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.