Method of mounting interrelated components
US4371912A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Oct 1, 1980 |
| Grant date | Feb 1, 1983 |
| Priority date | — |
| Expiry date | Oct 1, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49144
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
One specially designed fixture allows two components such as a microprocessor and its associated ROM to be simultaneously mounted on opposite surfaces of the substrate, with all or nearly all internal connections made through the area of the substrate between the components. A second fixture allows for wave soldering lead frames to the assembly while protecting the reflow soldered components. The method thus provides the most direct connections between the two components with all internal connections and external connections made by two automatic operations. A third component can be positioned astraddle the mounted assembly for minimum lead lengths.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.