Method for making multilayer printed wiring board
US4372804A · kind A · utility
24Cited by
5References
8Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 2, 1981 |
| Grant date | Feb 8, 1983 |
| Priority date | — |
| Expiry date | Apr 2, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/49146
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The thickness of copper foil at the land formation area of a copper clad laminate of a miniaturized high density circuit is made thicker than the remaining area to assure high reliability of connection between the through hole plating and the land.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.