Epoxy molding compound
US4373040A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jun 5, 1981 |
| Grant date | Feb 8, 1983 |
| Priority date | — |
| Expiry date | Jun 5, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08K13/02
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
An improved molding compound is described. The compound includes: PA0 (a) from about 5 to 90% by weight of curable epoxy resin; PA0 (b) from about 0.01 to 10% by weight of an aromatic onium salt of the formula: EQU [R.sub.a X].sub.b.sup.+ [C].sup.-b PA0 wherein each R is a monovalent organic aromatic radical; X is selected from the group consisting of sulfur and iodine; C is a lewis acid polymerization catalyst precursor; a equals the absolute value of the valence number of (X minus 1); and b equals the absolute value of the valence number of C; PA0 (c) from about 0.01 to 10% by weight of peroxide compound effective to activate said catalyst; and PA0 (d) from about 10 to 95% by weight of filler, based on the total weight of the composition. These molding compounds exhibit both superior curing rates and storage stability.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.