Method and apparatus for ultrasonic bonding
US4373653A · kind A · utility
22Cited by
6References
20Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 10, 1981 |
| Grant date | Feb 15, 1983 |
| Priority date | — |
| Expiry date | Sep 10, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/14
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A method and apparatus for providing high reliability ultrasonic bonds by monitoring the force required to separate the bonding tool from the wire after the bonding operation. This force which is required to break an incidental bond between the tool and the wire is related to the quality of the primary bond of the wire to a conductor terminal. The output of a transducer is proportional to the force and it may be coupled to a visual display, alarm, or computer for trend analysis.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.