Method of heat-sealing substrates

US4374696A · kind A · utility

Assignee

• FRAUNHOFER-GESELSCHAFT · DE

Inventors

• Helmut Schmidt · Riegelsberg, DE
• Gerhard Tunker · Offenbach, DE
• Horst Scholze · Würzburg, DE

Key dates

• Filing date: Mar 20, 1981
• Grant date: Feb 22, 1983
• Expiry date: Mar 20, 2001

Classification

• Technology area (CPC Y): Emerging Cross-Sectional Technologies
• CPC primary: Y10T428/31663
• WIPO field: Basic materials chemistry
• WIPO sector: Chemistry

Abstract

A method of heat-sealing substrates, particularly glass to glass or glass to other materials, which comprises using as a heat-sealing medium a silicic acid heteropolycondensate prepared by hydrolysis and polycondensation of at least one organosilane and at least one component selected from the group consisting of silicon-functional silanes, substantially involatile oxides soluble in the reaction medium, or compounds convertible thereto, and organofunctional silanes. The heat-sealing bonds obtained are strong, durable and moisture resistant, the excellent moisture resistance being of special benefit in the heat-sealing of glass substrates.