Composite diamond compact for a wire drawing die and a process for the production of the same
US4374900A · kind A · utility
59Cited by
10References
29Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jun 29, 1979 |
| Grant date | Feb 22, 1983 |
| Priority date | — |
| Expiry date | Jun 29, 1999 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12576
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
The present invention relates to a composite diamond compact for a wire drawing die, in which a part or all of the circumference of a diamond sintered body is surrounded by a cermet consisting of a hard compound of (Mo, W)C type carbide crystals containing molybdenum as a predominant component, bonded by an iron group metal, and the binder phase of the diamond sintered body contains an iron group metal and fine carbide crystals containing molybdenum as a predominant component.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.