Thin film techniques for fabricating narrow track ferrite heads
US4375390A · kind A · utility
12Cited by
6References
10Claims
0Family size
Inventors
Key dates
| Filing date | Mar 15, 1982 |
| Grant date | Mar 1, 1983 |
| Priority date | — |
| Expiry date | Mar 15, 2002 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG11B5/193
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
A process for producing a reactive ion-etched structure with height and width dimensions of the order of 25 microns or less on a ferrite substrate surface is disclosed. A mask of positive water saturated photoresist is formed on the substrate. A metal taken from the group consisting of nickel and a nickel-iron alloy is plated through the mask. The photoresist mask is removed to leave a pattern in the plated metal. The ferrite substrate surface that is exposed by the pattern is reactive ion etched with a power density of >1w/cm.sup.2 and a bias voltage <-100 volts.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.