Microwave power circuit with an active device mounted on a heat dissipating substrate
US4376287A · kind A · utility
60Cited by
8References
8Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Oct 29, 1980 |
| Grant date | Mar 8, 1983 |
| Priority date | — |
| Expiry date | Oct 29, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T29/4913
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A microwave power circuit includes a thermally conductive, electrically insulating substrate such as beryllium oxide which has a relatively rough surface, a layer of dielectric material such as glass on a portion of the rough surface which layer has a relatively smooth surface, a conductive material on the relatively smooth surface, and a heat dissipating amplifying device having at least two terminals, one of which is connected to the conductive material and one of which is thermally connected to the substrate in a manner to pass heat thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.