Acid copper electroplating baths containing brightening and leveling additives
US4376685A · kind A · utility
94Cited by
99References
45Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Jun 24, 1981 |
| Grant date | Mar 15, 1983 |
| Priority date | — |
| Expiry date | Jun 24, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/38
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
The invention is concerned with the electrodeposition of copper from an aqueous acidic bath containing the following additives: PA1 a. An alkylated polyalkyleneimine obtained as the reaction product of a polyalkyleneimine represented by the formula : EQU H.sub.2 N--(CH.sub.2).sub.n NH--R PA1 wherein R is H or (CH.sub.2).sub.n NH.sub.2 and n=1 to 6 with an epihalohydrin and an alkylating agent; an organic sulfo sulfonate; a polyether; and optionally a thioorganic compound.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.