High density interconnection means for chip carriers
US4377316A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 27, 1981 |
| Grant date | Mar 22, 1983 |
| Priority date | — |
| Expiry date | Feb 27, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY02P70/50
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A system for connecting a semiconductor chip carrier to a printed circuit card is described. The semiconductor chip carrier has a flexible, extendable wiring membrane attached to the bottom thereof which extends beyond the periphery of the semiconductor chip carrier and in the area beyond the periphery is provided with electrical contacts. The electrical contacts are mated to complementary contacts in a printed circuit card which is biased from the semiconductor chip carrier by electrical and thermal contact means. The membrane, inter alia, provides high density electrical contact between the semiconductor and printed circuit card. Various elements thereof and a process for forming the same are described.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.