Process for producing printed circuit board by electroless plating
US4378384A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Aug 31, 1981 |
| Grant date | Mar 29, 1983 |
| Priority date | — |
| Expiry date | Aug 31, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/122
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A process for producing a printed circuit board which comprises forming a plating film forming adhesive layer on the whole exposed surface of an insulating board, roughening said adhesive layer surface, depositing a catalyst for electroless copper plating on said adhesive layer surface from a catalyst solution, masking the thus treated insulating board surface excepting the part where a circuit is to be formed, and then performing the electroless copper plating on the catalyst of the board to form a circuit thereon, wherein an improvement comprises treating the roughened adhesive layer surface with an alkaline solution before depositing the catalyst thereon and treating the masked insulating board with an aqueous solution containing a surfactant before performing the electroless copper plating. The above process assures a higher copper utilization and a large adhesive strength of the copper plating to the board.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.