High capacitance bus bar manufacturing technique
US4381423A · kind A · utility
10Cited by
3References
34Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Mar 31, 1981 |
| Grant date | Apr 26, 1983 |
| Priority date | — |
| Expiry date | Mar 31, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K1/162
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A method of assembling a miniaturized bus bar which has high capacitance comprises forming a layer of ceramic material directly upon a bus bar conductor or directly upon a supporting metal strip which is attached to a first bus bar conductor. The exposed surface of the layer of ceramic material is subsequently mechanically and electrically bonded to a second bus bar conductor which extends parallelly with respect to the first bus conductor.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.