Apparatus for coating surfaces of a substrate
US4383495A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jun 21, 1982 |
| Grant date | May 17, 1983 |
| Priority date | — |
| Expiry date | Jun 21, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2203/0763
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
The walls 41 (FIG. 4) of thru holes 11 in a printed wiring board substrate 12 are coated with a liquid 24 by inserting fingers 22 into the thru holes. Each of the fingers has a diameter slightly less than the diameter of the associated thru hole and has a length no greater than the thickness of the substrate 12. After ink 24 has been applied to the top surface of the substrate, the inserted fingers 22 are withdrawn, thereby drawing the ink down into the thru holes and coating the walls 41. In another embodiment, fingers 62 are aligned with selected portions 52 of an edge 55 of the substrate 50 to coat the portions of the edge as the fingers are moved by the edge after the heads of the fingers have been coated with the ink 24.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.