Thermoplastic adhesive
US4384083A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Jul 22, 1981 |
| Grant date | May 17, 1983 |
| Priority date | — |
| Expiry date | Jul 22, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31587
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A thermoplastic adhesive composition that is particularly suitable for use as a hot melt adhesive is disclosed that comprises at least about 10% by weight of a polyether-based thermoplastic polyurethane and another component selected from the group consisting of: (A) a polyamide formed by the condensation of a compound of the formula EQU YN<Z>NH where Z is selected from the group consisting of ##STR1## where R is selected from the group consisting of hydrogen and alkyl groups having from 1 to 6 carbon atoms and R.sub.1 is a divalent aliphatic hydrocarbon group having at least 1 carbon atom, Y is selected from the group consisting of hydrogen, R'NH.sub.2 and R'OH where R' is a divalent alkylene radical having from 1 to 6 carbon atoms, with an amide forming derivative of a polymeric fat acid; (b) a thermoplastic copolyester made from the polyesterification reaction between terephthalic acid, cyclohexanedimethanol, a diol in addition to cyclohexanedimethanol and a dibasic acid in addition to terephthalic acid; or (C) a polyester-polyamide formed by heating a mixture of about 50 to about 99% by weight of component (A) with about 1 to about 50% by weight of component (B) at a temperatur…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.