Process of forming a plated wirepack with abrasive particles only in the cutting surface with a controlled kerf
US4384564A · kind A · utility
26Cited by
8References
6Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jan 22, 1981 |
| Grant date | May 24, 1983 |
| Priority date | — |
| Expiry date | Jan 22, 2001 |
Classification
- Technology area (CPC B)Performing Operations; Transporting
- CPC primaryB23D61/185
- WIPO fieldMachine tools
- WIPO sectorMechanical engineering
Abstract
A narrow wire blade with abrasive particles plated within a longitudinally-extending, plated cutting portion that extends from only one side of a wire core and has parallel side walls spaced by a controlled width.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.