Electroplating baths, additives therefor and methods for the electrodeposition of metals
US4384930A · kind A · utility
65Cited by
2References
33Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Aug 21, 1981 |
| Grant date | May 24, 1983 |
| Priority date | — |
| Expiry date | Aug 21, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC25D3/60
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
Bright level metal deposits can be obtained on substrates from aqueous acid plating baths containing water soluble salts of the metal to be deposited and at least one surfactant of the formula EQU ROCH.sub.2 CH(CH.sub.3)OCH.sub.2 CH(CH.sub.3)N(H)CH.sub.2 CH.sub.2 COOH (I) or ##STR1## wherein R is an alkyl group containing 10 to 12 carbon atoms; x and y are integers, the sum of which is from 2 to about 20. The aqueous acid plating baths of the invention will preferably contain as a brightening agent, at least one carbonyl-containing compound. These plating baths exhibit low foaming characteristics.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.