Molding compositions comprised of polyimide/N-vinylpyrrolidone prepolymer and epoxy resin
US4385154A · kind A · utility
2Cited by
2References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 15, 1981 |
| Grant date | May 24, 1983 |
| Priority date | — |
| Expiry date | Oct 15, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31786
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Novel thermosetting compositions, including a polyimide/N-vinylpyrrolidone prepolymer, optionally comprising an unsaturated polyester, and an epoxy resin, are well adapted for the molding of a variety of useful shaped articles.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.