Organopolysiloxane composition
US4385158A · kind A · utility
15Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 22, 1981 |
| Grant date | May 24, 1983 |
| Priority date | — |
| Expiry date | Jul 22, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC09D183/04
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
What is disclosed herein is a room temperature curable, one component epoxy resin modified silicone resin which has excellent heat resistance, adhesiveness to substrates, and is hard. The improvements in properaties are obtained by the use of epoxy fatty acid esters in the coating formulation.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.