Electroplating apparatus and method

US4385967A · kind A · utility

Assignee

• Chemcut Holdings LLC · US

Inventors

• Joseph M. Brady · Huntingdon, US
• Franz R. Cordes · State College, US
• Klaus Gedrat · Berlin, DE
• Daniel L. Goffredo · Riverton, US
• Walter Meyer · Berlin, DE
• Conrad D. Shakley · Spring Mills, US

Key dates

• Filing date: Oct 7, 1981
• Grant date: May 31, 1983
• Expiry date: Oct 7, 2001

Classification

• Technology area (CPC H): Electricity
• CPC primary: H05K3/241
• WIPO field: Surface technology, coating
• WIPO sector: Chemistry

Abstract

An electroplating apparatus and method is provided, whereby generally flat workpieces, such as metal plates and the like may be electroplated, on a continuous basis, automatically and without manual intervention. The workpieces are delivered horizontally through a bath of electrolyte. They are conveyed through the bath by being engaged by driven contact wheels that also serve as one of the electrodes. The other electrode is in the bath electrolyte solution. As the workpieces are delivered through the bath, they are engaged and disengaged by the contact wheels, but are always in engagement with contact wheels for not only continuous conveyance, but for continuous electrical connection therewith. A particular slide mount is provided for holding an opposite side of the plate as the plate is carried along its flow path, and this mount is adjustably positionable to accommodate different width workpieces. Solution flow through the electrolyte bath is provided on a continuous basis, and both agitates and replenishes the electrolyte solution. Dams are created at ends of the flow path, by the action of squeezing rollers, to prevent passage of electrolyte. Wipers are provided for preventing …