Thermoplastic resin composition having high heat resistance
US4386176A · kind A · utility
14Cited by
6References
10Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Jul 7, 1981 |
| Grant date | May 31, 1983 |
| Priority date | — |
| Expiry date | Jul 7, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S525/905
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A thermoplastic resin composition which has high heat resistance, high impact resistance and high molding processability and comprises 5-95% by wt. of a copolymer of a vinyl aromatic compound and an imide compound of an .alpha.,.beta.-unsaturated dicarboxylic acid and 5-95% by wt. of a polyphenylene ether resin together with or without up to 90% by wt. of an impact resistance reinforcing agent.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.