Polyacetals having an improved maximum sustained-use temperature
US4386178A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 28, 1981 |
| Grant date | May 31, 1983 |
| Priority date | — |
| Expiry date | Oct 28, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08L61/20
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
Polyacetal molding materials which contain, as a stabilizer, from 0.1 to 10% by weight of a melamine resin, the latter being a melamine-formaldehyde condensate, having a mean degree of polymerization of from 1.2 to 6.0 and a melamine:formaldehyde ratio of from 1:2 to 1:5.5, which has been partially etherified with a C.sub.1 -C.sub.4 -alkanol so that the ratio melamine:ether radicals is from 1:1.5 to 1:5.0 and the ratio melamine:free methylol groups is from 1:0.5 to 1:3. The molding materials can be converted to moldings which can be used industrially at elevated ambient temperatures.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.