Semiconductor apparatus with integral heat sink tab
US4387413A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Dec 24, 1980 |
| Grant date | Jun 7, 1983 |
| Priority date | — |
| Expiry date | Dec 24, 2000 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/10484
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor package is provided in which the semiconductor element is bonded to a slab of metal and is encapsulated in a body of insulating epoxy. Lead terminals are connected to the semiconductor element within the body and extend out from one end of the body. The metal slab extends out from the body from the same end as the lead terminals and in a plane which is parallel to that of the terminals, thereby forming a heat sink tab for the device. The package may be rigidly mounted on a printed circuit board by inserting the lead terminals and the heat sink tab into respective holes in a printed circuit board and soldering the terminals and tab to copper foil on the board. The solder connection of the heat sink tab to the copper foil provides an excellent thermal contact between the tab and the foil, in addition to providing a rigid support for the device.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.