Solid-state color-image sensor and process for fabricating the same
US4388128A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1981 |
| Grant date | Jun 14, 1983 |
| Priority date | — |
| Expiry date | Mar 11, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T156/1074
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
In a step for bonding a color filter to a solid-state color-image sensor chip with an adhesive which is curable not only by light or more particularly ultraviolet-ray irradiation but also by heating, pre-curing or partial curing is effected by irradiating light rays after the color filter and the chip has been pressed against each other and correctly aligned with each other in a bonding device and then the chip with the partially-bonded color filter is removed from the bonding device and complete curing of the adhesive is accomplished by heating. According to one embodiment of the present invention the bonding step is carried out in an atmosphere containing the oxygen so that the adhesive which has been squeezed out from the space between the color filter and the clip may be prevented from being cured and subsequently removed in a simple manner. According to a further embodiment of the present invention, prior to the bonding step, the color filter and chip are covered with protective layers or films so that surface flaws may be avoided. Thus, the color filters can be bonded to the chips with a higher degree of accuracy and a higher degree of adhesive strength and the mass productio…
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.