Heat-mode recording material
US4388400A · kind A · utility
28Cited by
10References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1981 |
| Grant date | Jun 14, 1983 |
| Priority date | — |
| Expiry date | Oct 6, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/24917
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
A heat-mode recording material is disclosed. The material comprises a base which is overlaid with a recording layer made of a metal, semimetal or semiconductor containing at least hydrogen.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.