Encapsulation of electronic components in bis-imido polymer
US4390596A · kind A · utility
Assignee
Inventor
Key dates
| Filing date | Nov 3, 1980 |
| Grant date | Jun 28, 1983 |
| Priority date | — |
| Expiry date | Nov 3, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
An active or passive electronic component is encapsulated within a bis-imido polymer molding composition, said polymer comprising (i) the thermosetting prepolymeric reaction product between a bis-imide having the structural formula: ##STR1## in which D represents a divalent organic radical containing an olefinic carbon-carbon double bond and A is a divalent organic radical containing from 2 to 30 carbon atoms, and a polyamine having the structural formula: EQU R(NH.sub.2).sub.x (II) in which x is an integer equal to at least 2 and R represents an organic radical of valency x, the amount of bis-imide being 0.55 and 25 mols per mol of NH.sub.2 groups provided by the polyamine; and said molding composition further comprising (ii) a free-radical polymerization initiator, and (iii) filler.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.