Patent · US Expired

Paste composition for the production of electrically conductive and solderable structures

US4391742A · kind A · utility

19Cited by

4References

7Claims

0Family size

Inventors

Wolf-Erhard Steigerwald · Bad Neustadt an der Saale, DE
Peter Ambros · Leutershausen, DE
Erich Gatzke · Bad Neustadt an der Saale, DE

Key dates

Filing date	Sep 22, 1980
Grant date	Jul 5, 1983
Priority date	—
Expiry date	Sep 22, 2000

Classification

Technology area (CPC Y)Emerging Cross-Sectional Technologies
CPC primaryY10T428/256
WIPO fieldAudio-visual technology
WIPO sectorElectrical engineering

Abstract

Paste composition for producing an electrically conductive and solderable structure along with the resulting article are disclosed. Metal particles, metal salts and an organic polymer binder are formed into a paste which is applied to a non-conductive substrate by printing or the like. The paste is heated to permit metal salts to migrate to the surface of the binder where they become concentrated. During metallizing the salts are removed by the bath and metal is deposited in pores formed in the binder by the dissolved salts. The metal layer is adherent to the binder and provides good solderable points.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.