Cooled semiconductor power module including structured strain buffers without dry interfaces
US4392153A · kind A · utility
50Cited by
17References
23Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Nov 6, 1978 |
| Grant date | Jul 5, 1983 |
| Priority date | — |
| Expiry date | Nov 6, 1998 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L2924/01079
- WIPO fieldSemiconductors
- WIPO sectorElectrical engineering
Abstract
A semiconductor electronic device operates at high power levels using structured copper to reduce generation of stress between the elements of the device during thermal cycling in the course of normal operation. Structured copper strain buffers are used to attach each side of a silicon wafer to fluid cooled heat sinks to provide efficient removal of heat generated by the device and good electrical connection to the silicon wafer.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.