Magnetron cathode sputtering system
US4392939A · kind A · utility
17Cited by
5References
4Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Apr 19, 1982 |
| Grant date | Jul 12, 1983 |
| Priority date | — |
| Expiry date | Apr 19, 2002 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/6838
- WIPO fieldElectrical machinery, apparatus, energy
- WIPO sectorElectrical engineering
Abstract
In a magnetron cathode sputtering system the target (plate of material to be sputtered) 8 is held against a backing plate 13 by a vacuum, enabling the backing plate 13 to be reused. By providing the backing plate with a layer of soldering material which adheres to the backing plate 13, but does not adhere to the target 8, heat transfer between the two plates is improved.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.