System for encapsulation of semiconductor chips
US4393130A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Jan 11, 1982 |
| Grant date | Jul 12, 1983 |
| Priority date | — |
| Expiry date | Jan 11, 2002 |
Classification
- Technology area (CPC G)Physics
- CPC primaryG03F7/00
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A system for encapsulating semiconductor chips, such as chips carrying chemical sensitive field-effect devices, includes lamination of a sheet of dry film photoresist material onto the surface of the chip, placement of a photomask over the chip in a predetermined alignment, and then exposure of the photomask to light so that light passes through certain light-transmitting portions of the mask onto the chip. The photoresist material is then developed to remove the material from over the gate regions of each of the field-effect devices to define windows in the material through which the gate regions are exposed. Chemical sensitive membrane systems may then be applied to the windows of the devices to cover the gate regions.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.