Thermosetting resin composition, process for preparation thereof and cured product thereof
US4393177A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Mar 11, 1981 |
| Grant date | Jul 12, 1983 |
| Priority date | — |
| Expiry date | Mar 11, 2001 |
Classification
- Technology area (CPC C)Chemistry; Metallurgy
- CPC primaryC08F299/022
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
The present invention relates to a thermosetting resin composition, a process for the preparation of this composition and a cured product obtained by heating and curing this composition. Both the thermosetting resin composition and cured product of the present invention comprise triallylisocyanurate (TAIC) and a poly(phenylmethylene)polymaleimide represented by the following general formula: ##STR1## wherein n is a number of at least 1. This composition is obtained by heating and dissolving the polymaleimide into TAIC. According to the intended use of the molded product, various additives may be added to the composition. For example, there may be added a radical-polymerizable thermosetting resin such as an unsaturated polyester, an epoxy acrylate resin or a diallyl phthalate prepolymer and a filler represented by a thermoplastic resin. The composition of the present invention is excellent in the compatibility and therefore, a good moldability is obtained at the molding step. Furthermore, the cured product of the present invention is excellent in the mechanical properties, electric properties and heat resistance.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.