Thermosetting prepolymer from polyfunctional maleimide and bis maleimide
US4393188A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Feb 12, 1981 |
| Grant date | Jul 12, 1983 |
| Priority date | — |
| Expiry date | Feb 12, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31721
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A process for preparing a thermosetting maleimide type prepolymer which comprises reacting (A) a polyfunctional maleimide compound, (B) a bis-maleimide, (C) a diamine and (D) an epoxy compound. The maleimide type prepolymer prepared according to the process of the present invention has rapid curability and excellent solubility in low boiling point solvents such as acetone, methyl ethyl ketone and methyl cellosolve, which are available at low cost. Accordingly, the prepolymer is advantageously used especially for the production of laminated boards having good heat resisting properties, low moisture absorption and good adhesion to various substrates such as a copper foil.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.