Laser diode with double sided heat sink
US4393393A · kind A · utility
37Cited by
10References
9Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | May 8, 1981 |
| Grant date | Jul 12, 1983 |
| Priority date | — |
| Expiry date | May 8, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01S5/4025
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A laser diode is soldered between metal plates for intimate thermal and electrical contact. The plates are prefabricated and are provided with an insulative spacer therebetween. The two metal plates are held together in a preferred orientation by the spacer which is firmly adhered and sealed to the two plates during the diode soldering operation. The metal plates are constructed from material thin enough that they yield under thermal pressure of the diode to eliminate mechanical strain on the diode during thermal cycling. Backup plates are provided in contact with the diode mounting plates to feed electrical energy thereto.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.