Copper base alloys made using rapidly solidified powders and method
US4395464A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Apr 1, 1981 |
| Grant date | Jul 26, 1983 |
| Priority date | — |
| Expiry date | Apr 1, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/12014
- WIPO fieldMaterials, metallurgy
- WIPO sectorChemistry
Abstract
New copper-rich metal alloys containing nickel along with certain specific amounts of boron are disclosed. The alloys are subjected to a rapid solidification processing (RSP) technique which produces cooling rates between .about.10.sup.5.degree. to 10.sup.7 .degree. C./sec. The asquenched ribbon, powder, etc. consists primarily of a metastable crystalline solid solution phase. The metastable crystalline phases are subjected to suitable heat treatments so as to produce a transformation to a stable multiphase microstructure, which includes borides. This heat treated alloy exhibits superior mechanical properties with good corrosion and/or oxidation resistance for numerous engineering applications.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.