Hot melt adhesives
US4395525A · kind A · utility
Assignee
Inventors
Key dates
| Filing date | Oct 6, 1980 |
| Grant date | Jul 26, 1983 |
| Priority date | — |
| Expiry date | Oct 6, 2000 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/2826
- WIPO fieldMacromolecular chemistry, polymers
- WIPO sectorChemistry
Abstract
A hot melt adhesive having a good thermal stability under load, based on a copolymer of a predominant proportion of acrylates or methacrylates, a minor proportion of acrylic or methacrylic acid amides and further based on acrylic or methacrylic acid compounds, characterized in that the copolymer comprises PA0 (a) 85 to 95% by weight of alkyl acrylates and/or methacrylates with 1 to 12 carbon atoms in the alkyl radical, PA0 (b) 3 to 10% by weight of acrylamide and/or methacrylamide, PA0 (c) 0.2 to 5% by weight of one or more olefinically unsaturated mono- or dicarboxylic acids with up to 5 carbon atoms, the sum of components (a) to (c) amounting to 100%, at a and a process for preparing a multi-layer article, containing said adhesives.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.