Patent · US Expired

Thermoset-thermoplastic aromatic polyamide containing N-propargyl groups

US4395540A · kind A · utility

1Cited by
1References
7Claims
0Family size

Assignee

Inventors

Key dates

Filing dateOct 23, 1980
Grant dateJul 26, 1983
Priority date
Expiry dateOct 23, 2000

Classification

  • Technology area (CPC C)Chemistry; Metallurgy
  • CPC primaryC08G69/28
  • WIPO fieldMacromolecular chemistry, polymers
  • WIPO sectorChemistry

Abstract

A novel composition and method for increasing the use temperature of polyamides based on the incorporation of a latent crosslinking agent into the polymer backbone, wherein high temperature performance is achieved without sacrificing solubility or processability.

Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.