Pattern forming method and pattern forming apparatus using exposures in a liquid
US4396705A · kind A · utility
466Cited by
4References
14Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Sep 18, 1981 |
| Grant date | Aug 2, 1983 |
| Priority date | — |
| Expiry date | Sep 18, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH01L21/30
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A pattern forming method comprising a step of disposing a substrate with a coated film of photosensitive composition and a mask having a predetermined pattern in a first liquid which does not dissolve said coated film of photosensitive composition, and a step of exposing said coated film to light through said mask. An apparatus for attaining this method is also disclosed. The influence of dust can be readily avoided and an image with high resolution is obtained.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.