Organic solid substrate dewatering process based on plug flow contact by an extractive fluid
US4397100A · kind A · utility
9Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Dec 4, 1981 |
| Grant date | Aug 9, 1983 |
| Priority date | — |
| Expiry date | Dec 4, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S366/01
- WIPO fieldChemical engineering
- WIPO sectorChemistry
Abstract
A method of removing water from organic solid substrates, such as peat, wherein a primary solvent is used to extract water from the substrate and the primary solvent and the substrate are kept in plug flow during contact, and then a secondary solvent may be used to separate the primary solvent from the water.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.