Low thermal impedance plastic package
US4399453A · kind A · utility
38Cited by
6References
7Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 23, 1981 |
| Grant date | Aug 16, 1983 |
| Priority date | — |
| Expiry date | Mar 23, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH10H20/8581
- WIPO fieldOptics
- WIPO sectorInstruments
Abstract
A package for fiber optic semiconductor devices is disclosed in which heat is conducted by both a heat spreader and through a plastic enclosure portion of the package.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.