Right circular substrate packaging
US4399488A · kind A · utility
13Cited by
5References
5Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Aug 3, 1981 |
| Grant date | Aug 16, 1983 |
| Priority date | — |
| Expiry date | Aug 3, 2001 |
Classification
- Technology area (CPC H)Electricity
- CPC primaryH05K2201/0999
- WIPO fieldAudio-visual technology
- WIPO sectorElectrical engineering
Abstract
Packaging of microelectronics utilizing a series of various size cylinders hich are assembled and sealed from the environment, providing electrical connections out opposite ends of the cylinders and providing for a center opening in the inner cylinder to allow other structure such as a warhead to be mounted therein are aspects of this invention.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.