Stress sensitive semiconductor unit and housing means therefor
US4399707A · kind A · utility
61Cited by
14References
11Claims
0Family size
Assignee
Inventor
Key dates
| Filing date | Feb 4, 1981 |
| Grant date | Aug 23, 1983 |
| Priority date | — |
| Expiry date | Feb 4, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10S73/04
- WIPO fieldMeasurement
- WIPO sectorInstruments
Abstract
A stress sensitive semiconductor die and housing means therefore comprising a ceramic base member having a recessed portion and a shoulder portion around the periphery. A washer-like support member is positioned within the recess, one face of which is bonded to the base member, said support member having a central aperture. A stress sensitive semiconductor die is bonded to the other face of the support member with the center of the die being in substantial register with the aperture in the support member. Finally, cover means are attached to the shoulder portion.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.