Process for producing fire retardant and heat resistant copper-clad laminated board, and varnish therefor
US4400438A · kind A · utility
6Cited by
4References
3Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Mar 30, 1981 |
| Grant date | Aug 23, 1983 |
| Priority date | — |
| Expiry date | Mar 30, 2001 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31681
- WIPO fieldSurface technology, coating
- WIPO sectorChemistry
Abstract
A process for producing a fire retardant and heat resistant copper-clad laminated board, characterized in that a maleimide resin type varnish containing a small amount of a specific halogenated diphenyl ether compound is used for impregnation of base material therewith. Copper-clad laminated boards produced according to the present invention may be so improved in fire or flame retardant properties as to be classed 94 V-0 in accordance with UL 94 (vertical burning test), and, nevertheless, are not substantially downgraded in heat resisting properties as well as copper foil peel strength.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.