Primer composition used for adhesion
US4401500A · kind A · utility
69Cited by
3References
17Claims
0Family size
Assignee
Inventors
Key dates
| Filing date | Feb 25, 1982 |
| Grant date | Aug 30, 1983 |
| Priority date | — |
| Expiry date | Feb 25, 2002 |
Classification
- Technology area (CPC Y)Emerging Cross-Sectional Technologies
- CPC primaryY10T428/31663
- WIPO fieldBasic materials chemistry
- WIPO sectorChemistry
Abstract
A mixture of an alkoxy containing silicon compound, a hydroperoxide, and organic solvent is a primer composition useful for bonding heat curing silicone rubber, especially fluorosilicone rubber, to a substrate.
Source: USPTO / EPO open patent data. Objective bibliographic and citation counts.